Application of picosecond laser marking machine in mobile phone industry

At present, laser processing has been widely used in laser marking, laser drilling, laser cutting and welding, material surface modification, laser rapid prototyping, laser composite processing and so on. Laser processing technology can be seen everywhere in the manufacturing process of various components of smart phones, such as cell phone casing cutting, marking, soldering, motherboard manufacturing, keyboard chip marking and earpieces, earphones, engraving and punching of trims, and so on.

In the process of marking, the fiber laser marking machine is generally used for marking relevant information. Although in many current micromachining applications, we can use the nanosecond laser marking machine to achieve, but there are still some deficiencies in the degree of refinement. The main reason is that the use of such laser equipment for micro-processing of mobile phones is likely to give more heat to mobile-related fine products, resulting in melting, cracking, surface composition changes and other harmful side effects.

However, with today's picosecond laser marking machines, true heatless machining can be achieved in the fine-grained markings of mobile phones. In the actual marking process, the picosecond laser device can realize high-speed, high-quality fine marking on the mobile phone related products, and the nanosecond laser device is often difficult to achieve the same quality, and is prone to various defects. Heating of the surface of the marking caused by long nanosecond pulses causes a series of related problems, including edge bulging, melting, debris, cracking or damage to the substrate.

In addition to avoiding heat-related defects, the use of today's picosecond laser equipment can also increase processing efficiency. The use of other marking equipment for the fine processing of mobile phone related components requires a long interaction time, which leads to more energy wastage, so the heat causes melting and also rapidly spreads in the area where the processing is modified. On the other hand, the picosecond laser device has a short interaction time. Almost all of the energy is directly applied to the labeled mobile phone component related products through the laser pulse, realizing instantaneous laser ablation and high processing efficiency. .